Direct FIB with high resolution or 3-dimensional structures
1-mm fluidic channel and array of plasmonic gold cakes
Expanded capabilities due to SEM high resolution inspection, gas inspection and nano manipulation
VELION challenges the nanofabrication by realizing the synergy of a focused ion beam and lithography platform. Direct FIB processing techniques are complemented by the highest-accuracy laser interferometer stage.
By choosing and optimizing versatile techniques, it helps to apply direct and simplified process with repeated accurate results over extended time and area.
stable and automated FIB milling enables large arrays of high-resolution features, as required for plasmonic applications
Write field stitching allows for direct milling of long wave guides with offsets on 10 nm scale only
Detailed in-situ SEM inspection of plasmonic features created by FIB milling
EBL test pattern for determining the line width for different dose factors
The roundness of an X-ray lens is checked by advanced SEM metrology line scans
Demo example (transistor like pattern) showing EBL overlay capabilities
SEM high-resolution imaging and automated metrology can be applied to various patterning results and microscopy samples.
Electron Beam Lithography with the optics design and powerful patterning engine for the SEM column, the system offers EBL workhorse capabilities. This enables sophisticated applications in nano electronics, physics, and photonics, and combines with FIB nanofabrication in one instrument. VELION offers the unique opportunity of complementary advanced lithography with both ion and electron beams in a single dedicated nanofabrication system.
The field emission SEM column significantly expands the capabilities of VELION. VELION helps to provide all the required capabilities of a FIB tool for TEM, APT or other sample preparation.
The X-section analysis is employed for high resolution imaging of FIB X-sectional cuts.
The process checks helps in the inspection of all features created by the ion beam. Given the direct patterning techniques of FIB, it is possible to check results and optimize parameters in an in-situ closed-loop approach for very efficient process development
X-sectional process control of an X-ray Fresnel zone plate fabricated in 500nm thick gold
Top-down high resolution SEM imaging used for lateral process control of FIB milling
The 3-dimensional shape of a special antireflective grating is revealed by X-section analysis
Placement, straightness and pitch of the 3-dimensional grating are checked by SEM inspection